GENESTAR™ is a low water absorption and heat-resistant polyamide resin, with excellent moldability, mechanical properties, and reflow resistance, used in various electronic components including SMT connectors. In addition to heat resistance, it has excellent electrical properties, sliding properties, and combustion characteristics. We provide different grades that meet to the trend of the shapes of SMT connectors and electronic components like thin walls and narrow pitches according to the required performance.
PA9T does not form blisters easily.
PA9T has superior dimensional stability for a polyamide.
With superior mechanical strength and sliding properties, they are widely used in jack products involving frequent connecting and disconnecting.
It has excellent fluidity, strength(rigidity) and low warpage, and it can be used in thin-walled connectors.
Wire connectors which require high strength are a classic example of GENESTAR™ in use.
It has excellent appearance, dimensional stability, moldability, and strength. Contributes to dust reduction.
With a great balance of moldability, low warpage, and high strength, it is suitable for long products.
With superior mechanical strength, low warpage, slidability, and strength, it has been widely used in card connectors.
|Grade name||Grade||Grade details||Features||Application examples|
|GP2300F||V-0 flame-retardant、High-flow、Halogen-free||Does not contain chlorine or bromine with V-0 flame retardant rating. A new grade that can handle the fluidity of narrow pitch.
(Glass content: 30%)
* “Halogen-free” indicates less than 900 ppm of bromine (Br), less than 900 ppm of chlorine (Cl), and less than 1,500 ppm of total halogen content (Br, Cl).
|High flow||USB type-C connector、Board-to-cable(FPC) connector|